Electronics used within products are constantly changing and improving, but the need to ensure proper cooling of these components remains. To maximize product performance engineers, need to overcome common electronics cooling challenges like:
Moldflow 2019 - Sinkmark Overmolding
This report is about sink-mark analysis for 3D Thermoplastics Overmolding process.
Moldflow 2019 - Sink Mark Consolidation Validation
This report is to demonstrate that, after the consolidation of formulas used for sink mark calculation, the consistency of sink depth predictions have been improved between Autodesk Moldflow Insight Midplane and 3D solutions.
Moldflow 2019 - New Conformal Cooling Solver Validation Report
This report is aimed to introduce the newly developed conformal cooling solver which has better performance and Linux support. The detailed workflow is described in this report and the comparison between the new solver and old solver is also given.